Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methodsWhat is BS EN 61191 6 Evaluation of voids in BGA and LGA soldered connections about? BS EN 61191 6 is the sixth part of a multi series standard used for Printed board assemblies that specifies the measuring methods for voids in soldered joints of BGA and LGA. BS EN 61191 6 is useful in evaluating these voids that results in manufacturing good quality printed boards. BS EN 61191 6 specifies the evaluation criteria for voids on the scale of the thermal

It covers a mandatory format for representing a catalogue of linked-data resources

Part 1: System requirements

Key stakeholders are brought together to collaboratively produce a BSI-endorsed PAS that has all the functionality of a British Standard for the purposes of creating management systems

carbonation of beverages

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as described in IEC 60695-1-11 and IEC 60695-1-12

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